Key Info

• The top part of the housing, the inner frame and the substrate are forming a pressure chamber;
• During screw down, the top part of the housing transfers the screw force to the silicone gel, which is incompressible;
• The silicone gel is pressing the substrate and all mounted components on its entire area to the heatsink
• The resulting even pressure distribution avoids stress gradients in the substrate and eliminates the cracking
• No direct mechanical contact between top part of the housing and the DCB
  • no step height & no convexity
  • stress free ceramic substrate mounting

Key Benefits

• Homogeneous pressure and R_th value distribution
• Rugged and reliable heat sink assembly
• Higher power capability
• Increased power density